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Please contact:
Jeffrey Geddes
Account Manager, Heavy Reading Insider Services
303-997-9135
or via email at:
geddes@
lightreading.com |
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| Next-Gen Sonet/SDH Chip Survey |
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Multiservice edge equipment based on tightly integrated, next-gen Sonet/SDH silicon has radically improved carriers' ability to offer packet services over legacy infrastructure.
Encouraged by this success, chip makers and equipment manufacturers are now turning their attentions to smaller, less-expensive access products. This survey compares 31 products, from the ten leading chip vendors in the market, against 17 individual criteria. |
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| Sample research excerpts from the report are shown below: |
|
 Table of Contents (0704toc.pdf) |
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| This figure shows a typical next-generation framer/mapper device. The report covers this functionality, in detail, from left to right: |
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| [click on the image above for the full excerpt] |
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| The framer/mapper devices in this report cover a wide range of bandwidths and applications. The TDM, Ethernet, and packet processor interfaces supported by each device are shown in this table (company names removed). |
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| [click on the image above for the full excerpt] |
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 The survey compares products against the following criteria: bandwidth; Sonet/SDH line interfaces; automatic protection switching; TDM crossconnects; transparent GFP; LAPS; ATM termination; VCAT; VCAT groups; differential delay; LCAS; packet processor I/F; Ethernet MACs; TDM I/O; power; price; and sample availability. |
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| Silicon vendors analyzed in this report: Agere Systems Inc. (NYSE: AGR.A); Applied Micro Circuits Corp. (Nasdaq: AMCC); Arrive Technologies; Cypress Semiconductor Corp. (NYSE: CY); Galazar Networks Inc.; Infineon Technologies AG (NYSE/Frankfurt: IFX); Intel Corp. (Nasdaq: INTC); PMC-Sierra Inc. (Nasdaq: PMCS); TranSwitch Corp. (Nasdaq: TXCC); Vitesse Semiconductor Corp. (Nasdaq: VTSS). |
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| Total pages: 24 |
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| To view reports you will need Adobe's Acrobat Reader. If you do not have it, it can be obtained for free at the Adobe web site. |
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