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LTE Chip Makers Ramp Up Production to Meet Demand
Mobile carriers need Long Term Evolution (LTE) to deliver high-quality services to smartphone users. LTE will provide the reduced latency, increased peak bandwidth, and greater network capacity required for the advanced voice, data, and video applications made possible by the latest mobile phones. HD video, which the iPhone 4 supports, is only the latest in a stream of new applications that will stretch 3G networks to the breaking point. LTE is a fourth-generation wireless network that is backward compatible with existing solutions, and it will meet the long-term needs of carriers and their customers for high-speed data traffic supporting Internet browsing, voice, and video.

Semiconductor components are key to the successful rollout of LTE networks. The LTE semiconductor market is very competitive, with multiple vendors developing baseband and radio frequency (RF) devices. With LTE, we see components developed by existing mobile baseband and RF market leaders, startups targeting the LTE market, and well-established companies shifting from WiMax to LTE. As LTE develops, there is pressure on semiconductor vendors to introduce devices supporting additional frequency bands and a complex mix of networks, bandwidth, and performance. To meet these challenges, vendors must develop flexible and highly integrated devices that meet the performance criteria and deliver cost-effective and power-efficient solutions.

The introduction of the iPhone and other smartphones in the consumer market has dramatically increased user expectations and driven exponential mobile data traffic growth. To meet these expectations, carriers are investing in IP-based mobile broadband service delivery. Average revenue per mobile user is growing more slowly than data per user, which is putting carrier profitability under pressure. LTE is a significant step forward for wireless carriers, reducing the cost per user and delivering peak rates of 100 Mbit/s and above.

LTE silicon vendors are well placed to meet demand. The rollout of LTE networks will not be limited by LTE silicon availability. Established mobile chipset vendors are being threatened by alternative solutions delivering integrated solutions for micro, pico, and femto base stations and very low-power and highly integrated handset devices. If the established vendors are slow in delivering fully functional multimode devices, there will be significant opportunities for Tier 2 vendors that have established credibility in either the HSPA or WiMax markets.

LTE Chip Makers Ramp Up Production to Meet Demand details and analyzes LTE chips and technologies, identifying the market opportunity and key advantages they hold for equipment manufacturers. It also surveys component availability, reviewing features, performance, and flexibility. The report covers more than 30 baseband and RF devices and profiles 24 leading vendors in this rapidly growing market.

Sample research data from the report is shown in the excerpts below:
Table of Contents (cci0710toc.pdf)
Carrier commitment to LTE continues to grow. According to the Global mobile Suppliers Association there are now 110 operators across 48 countries committed to LTE. By the end of 2010, 22 LTE networks are expected to be operational, and more operators will be evaluating LTE. The following excerpt shows that LTE is expected to grow rapidly from 2013 onward. The LTE infrastructure market is expected to reach $11.4 billion by 2014 (Infonetics Research, April 2010) and analysts expect 136 million LTE subscribers (Pyramid Research, May 2009) paying $70 billion in service revenue (Juniper Research); an average of $42 per subscriber per month.
[click on the image above for the full excerpt]
Companies profiled in this report include: Altair Semiconductor; Analog Devices Inc. (NYSE: ADI); Beceem Communications Inc.; BitWave Semiconductor Inc.; ComSys Communications & Signal Processing Ltd. (Comsys Mobile); DesignArt Networks Ltd.; Freescale Semiconductor Inc.; Fujitsu Ltd. (Tokyo: 6702; London: FUJ; OTC: FJTSY); Genasic Design Systems Ltd.; Icera Inc.; Infineon Technologies AG (NYSE: IFX); Lime Microsystems Ltd.; Maxim Integrated Products Inc. (Nasdaq: MXIM); Mindspeed Technologies Inc. (Nasdaq: MSPD); picoChip Designs Ltd.; Qualcomm Inc. (Nasdaq: QCOM); Semtech Corp. (Nasdaq: SMTC); Sequans Communications; ST-Ericsson, a joint venture of STMicroelectronics NV (NYSE: STM) and Ericsson AB (Nasdaq: ERIC); Tensilica Inc.; Texas Instruments Inc. (NYSE: TXN); Wavesat Inc.; Wintegra Inc.; and Xilinx Inc. (Nasdaq: XLNX).
Total pages: 21
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