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David Williams
Global Director of Sales, Research
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WiMax Chipset 2006 Market Outlook
With service provider and system vendor support for WiMax on the increase, the pressure on chipset suppliers to develop the high-performance and low-cost chipset components crucial to the technology's success is intense.

This report analyzes the product strategies and positioning of the leading private and public WiMax chipmakers, with a focus on the technology roadmaps and the types of end-user devices these vendors are targeting.

The performance of the chipset technology underlying WiMax is expected to have a major impact on wireless network economics, with developers working to optimize the cost/benefit tradeoffs associated with the support of advanced features such as mobility, multiple antenna systems, and multiband operation.

The aim is to provide low-cost, robust, and broadly deployed WiMax networks that outperform other types of access networks. The debate is over how, when, and at what cost to introduce chipset features such as MIMO that will deliver the required performance.

Sample research data from the report is shown in the excerpts below:
Table of Contents (uni0106_toc.pdf)
Venture investment in WiMax silicon is not yet anywhere near the levels reached in 802.11 or DSL - the market is just too risky. Nevertheless, money is flowing into the sector. The excerpt below provides details on seven privately held 802.16 vendors, which collectively have raised approximately $160 million.
[click on the image above for the full excerpt]
Private WiMax chipset vendors covered in this report: Beceem Communications Inc., Cygnus Communications Inc., PicoChip Designs Ltd., Runcom Technologies Ltd., Sequans Communications, TeleCIS Wireless Inc., and Wavesat Wireless Inc.
Public WiMax chipset vendors covered in this report: Altera Corp. (Nasdaq: ALTR), Freescale Semiconductor Inc. (NYSE: FSL), Fujitsu Ltd. (Tokyo: 6702; OTC: FJTSY), Intel Corp. (Nasdaq: INTC), STMicroelectronics NV (NYSE: STM), and Xilinx Inc. (Nasdaq: XLNX).
Total pages: 19
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